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Latest News:
The Balver Zinn Group to Debut OT2 Solder Paste and BRILLIANT B2012 Wire at Productronica 26 Aug 2013 | 12:23 pm
Balver Zinn Group will exhibit in Hall A4, Stand 451 at the Productronica Trade Fair, scheduled to take place November 12 - 15, 2013 in Munich, Germany. Representatives from Balver Zinn and Cobar will...
Cobar to Exhibit New Solder Wire and Paste Technologies at SMTA International 1 Aug 2013 | 07:20 pm
The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit in Booth #605 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth ...
Cobar to Exhibit Water Soluble LF3237 Solder Wire at SMTA Upper Midwest 10 Jun 2013 | 04:47 pm
The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit Balver Zinn water soluble LF3237 Solder Wire in Booth # 44 at the upcoming SMTA Upper Midwest Expo and Tech forum.
Balver Zinn / Cobar hinting about their big release 6 Jun 2013 | 04:13 pm
Cobar's CEO, Stan Renals, talking about competition and giving some hints on our latest solder paste!
National Holidays 8 May 2013 | 01:54 pm
Dear Customer, We hereby inform you that Balver Zinn, Germany and Cobar, Holland will be closed 9-10 May because of national holidays. With best regards, The Balver Zinn Group
A New Low VOC Flux Technology Is Available for Vintage Machines Using Foam Fluxers 2 May 2013 | 05:36 pm
The Balver Zinn Group announces that Cobar Solder Products Inc. has introduced its new 95 RX Flux Series. The low VOC flux technology has been developed for vintage soldering machines that still use f...
Happy Easter to you all! 28 Mar 2013 | 04:21 pm
Easter is finally upon us and we want to thank you for the fruitful and successful cooperation.
Balver Zinn Singapore to Sponsor IPC Hand Soldering Competition in Conjunction with NEPCON Korea 2013 12 Mar 2013 | 02:46 pm
The Balver Zinn Group announces that Balver Zinn Singapore will sponsor and contribute SN100C solder wire to the IPC Hand Soldering Competition at NEPCON Korea 2013. Scheduled to take place from April...
The Balver Zinn Group to Highlight a Host of Solder Materials during SMT/HYBRID/PACKAGING 2013 28 Feb 2013 | 01:46 pm
The Balver Zinn Group will exhibit numerous leading-edge products at the upcoming SMT/HYBRID/PACKAGING on booth #9-312, which is scheduled to take place from 16-18 April 2013 at the exhibition center ...
Thomas Kolossa leaving Balver Zinn 9 Jan 2013 | 07:16 pm
Our European Sales and Support Manager, Mr. Thomas Kolossa left at the end of 2012 the Balver Zinn group. His commercial duties will be taken over by Mr. Bernd Schulte and technical support by Mr. Pao...
