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Latest News:
New air-only applications from ERS bring higher throughput to wafer thermal test 1 Feb 2013 | 04:25 pm
Flexible air-cooling enables customer-specific wafer test applications reducing time needed to reach thermal stability of test environment
ERS FOWLP Competence Center now supporting a growing and diverse advanced packaging market 5 Dec 2012 | 04:00 am
Interest grew sharply in 2012 for ERS center supporting advanced WLP technology
ERS displayed sub-zero module of its new AirCool®3 System in Tokyo 15 Feb 2012 | 01:00 pm
ERS gave live demonstrations of the highly compact, air-only -25°C module of its new wafer thermal test system.
ERS introduces AirCool®3 at Semicon Europa 2011 11 Oct 2011 | 10:00 am
Affordable upgrade path to full cold performance
ERS Receives eWLB Patent in Singapore 30 Apr 2011 | 10:00 am
Debonding and warpage adjust methods
ERS Receives eWLB Patent in Japan 10 Mar 2011 | 12:00 pm
First granting of world-wide eWLB patent
ERS Launches FOWLP Global Competence Center 10 Mar 2011 | 12:00 pm
Support for FOWLP / eWLB advanced Wafer-Level Packaging, embedded silicon die
Shipment of the ADM300 Debonding System 10 Jun 2010 | 10:00 am
Sub-Con orders new 300mm eWLB Debonding Tool
ERS awarded ISO 9001:2008 Recertification 28 May 2010 | 10:00 am
TÜV confirms ERS Compliance
ERS defends AirCool® Plus and PowerSense® patents 17 Dec 2008 | 12:00 pm
ERS electronic air-only cooling and active thermal dissipation patents defended
